Speaking at the groundbreaking ceremony for NXP Malaysia’s expansion project, Digital Minister Gobind Singh Deo stated that efforts to transform Malaysia into a leading global microelectronics hub will continue to be strengthened through technological advancements.
He highlighted that the nation’s rapidly expanding semiconductor industry plays a significant part in driving Malaysia’s tech-driven transformation. According to the Minister, Malaysia is making significant strides in high-value segments, including integrated circuit (IC) design, advanced chip packaging, and artificial intelligence (AI) hardware.
To accelerate this progress, targeted initiatives undertaken jointly by the government and the private sector are enhancing local research and development (R&D) capabilities while boosting production capacities. Gobind Singh Deo noted that these measures will attract high-tech investments, generate high-value technical employment, and offer Malaysians direct opportunities to work with cutting-edge technologies that will shape the future manufacturing landscape.
However, he stressed that equipment and technology alone do not guarantee success; cultivating a highly skilled workforce within the technology sector is equally crucial.
Furthermore, the Minister remarked that NXP Malaysia’s expansion project reflects the longstanding and robust bilateral relations between Malaysia and the Netherlands. Such strategic partnerships underscore Malaysia’s enduring commitment to remaining a reliable, competitive, and long-term partner for global technology enterprises.
Source: The Star
